Full Name: Dr. DANG Thi Thanh Le Work address: Room 305, ITIMS-Building, No. 1, Dai Co Viet, Hai Ba Trung, Hanoi, Vietnam Email: thanhle@itims.edu.vn Position: Lecturer Tel: 84 4 38680787 (Ext. 301) Fax: 84 4 38692963 1. Teaching Courses: - Not Available 2. Research Interests: Synthesis, Characterization and Application of Nanomaterials for Gas Sensing Technologies of fabricating nanosensors3. Published Papers (journal papers): Nguyen Van Hieu*, Dang Thi Thanh Le, Le Viet Thong, Do Thanh Viet, Do Cong Minh, Nguyen Van Quy, Nguyen Duc Hoa, Phuong Dinh Tam, Anh-Tuan Le, “A comparative study on the NH3 gas-sensing properties of ZnO, SnO2, and WO3 nanowires”, Int. J. Nanotechnology, (2011), Vol. 8, Nos. 3/4/5, 174-187. Le Viet Thong, Nguyen Duc Hoa, Dang Thi Thanh Le, Do Thanh Viet, Phuong Dinh Tam, Anh Tuan-Le, and Nguyen Van Hieu*, “On-chip fabrication of SnO2-nanowire gas sensor: The effect of growth time on sensor performance”, Sensors and Actuators B, (2010), B146, 361-367. Dang Thi Thanh Le, Dang Duc Vuong, Nguyen Duc Chien, “Synthesis and LPG-sensing properties of TiO2 nanowires”, J. Phys.: Conf. Ser. 187, (2009) 012086. Dang Thi Thanh Le, Dang Duc Vuong, Nguyen Duc Chien, “Synthesis and gas-sensing properties of TiO2 nanowires”, Advances in Natural Sciences, Vol. 9, No. 1, (2008), 303-308. 4. Published Books: - Not Available 5. Other information: Education: Degree Year of graduation Field and university Doctor 2011 Electronical Materials Technology/Hanoi University of Science and Technology (HUST) Master 2001 Materials Science/International Training Institute for Materials Science (ITIMS) Bachelor 1999 Physico-Chemistry/Hanoi National University of Education (HNUE) Brief research background and working experiences: 2005-present: Lecturer at ITIMS-HUT 2001-2005: Researcher at ITIMS Remarkable scientific projects: Fabrication on ethanol sensing device based on TiO2 nanowires-Project under supporting finacially by Ministry of Science and Technology-Promoter Honors and awards: Best poster prize at International Conference on Engineering Physics (ICEP), 2006. |
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